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HomeTechnologyQualcomm unveils new Wi-Fi 7-capable chipsets with over 20 Gbps capacity

Qualcomm unveils new Wi-Fi 7-capable chipsets with over 20 Gbps capacity


Global chip-maker has unveiled Wi-Fi 7-capable chipsets as a part of its new “Immersive Home Platform”, which are built to support the latest high-speed broadband connections and an array of high-performance devices.

The new Wi-Fi 7 Immersive Platform will deliver more than 20 Gbps of total system capacity in a compact, power-efficient, cost-effective network chipset architecture, according to the company.

“We developed the Immersive Home Platform to enable high-performance connectivity in a cost-effective, low-profile form factor delivering the newest innovations in home networking” Nick Kucharewski, senior vice president and general manager, Wireless Infrastructure and Networking, Technologies said in a statement.

The new Qualcomm chips are currently being sampled by manufacturers of home routers and mesh Wi-Fi devices, and they are expected to be available in the second half of 2023.

The chipset is also engineered to enable collaboration, telepresence, AR/VR, and immersive gaming applications of today’s and tomorrow’s home, said the company.

The new Wi-Fi 7 is designed to offer maximum connectivity to the latest high-performance devices, delivering peak speeds of up to 5.8 Gbps to a single connected device.

Qualcomm’s new platform also includes a mesh networking known as Multi-Link Mesh.

The company says it can reduce real-time latency by 75 per cent for lag-free gaming experiences.

It uses Adaptive Interference Puncturing to avoid congested home environments and avoidance algorithms to avoid interference from other networks.



(Only the headline and picture of this report may have been reworked by the Business Standard staff; the rest of the content is auto-generated from a syndicated feed.)


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