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HomeTechnologyQualcomm unveils new Wi-Fi 7-capable chipsets with over 20 Gbps capacity

Qualcomm unveils new Wi-Fi 7-capable chipsets with over 20 Gbps capacity

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Global chip-maker has unveiled Wi-Fi 7-capable chipsets as a part of its new “Immersive Home Platform”, which are built to support the latest high-speed broadband connections and an array of high-performance devices.


The new Wi-Fi 7 Immersive Platform will deliver more than 20 Gbps of total system capacity in a compact, power-efficient, cost-effective network chipset architecture, according to the company.


“We developed the Immersive Home Platform to enable high-performance connectivity in a cost-effective, low-profile form factor delivering the newest innovations in home networking” Nick Kucharewski, senior vice president and general manager, Wireless Infrastructure and Networking, Technologies said in a statement.


The new Qualcomm chips are currently being sampled by manufacturers of home routers and mesh Wi-Fi devices, and they are expected to be available in the second half of 2023.


The chipset is also engineered to enable collaboration, telepresence, AR/VR, and immersive gaming applications of today’s and tomorrow’s home, said the company.


The new Wi-Fi 7 is designed to offer maximum connectivity to the latest high-performance devices, delivering peak speeds of up to 5.8 Gbps to a single connected device.


Qualcomm’s new platform also includes a mesh networking known as Multi-Link Mesh.


The company says it can reduce real-time latency by 75 per cent for lag-free gaming experiences.


It uses Adaptive Interference Puncturing to avoid congested home environments and avoidance algorithms to avoid interference from other networks.


–IANS


shs/ksk/

(Only the headline and picture of this report may have been reworked by the Business Standard staff; the rest of the content is auto-generated from a syndicated feed.)

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